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Process part Process Products Attributes & Functions Main Usages
Pre
Treatment		 Cleaner 110/110HS Removing the oxide, duty, fingerprint Pre-process de-oiling of Regular PCB
115
Etching 120 Form roughness on surface to enhance bonding FPCB/Regular PCB
120S
121S
123
123
130
135
140
150
Soda Ash 180 Dry Film removal Regular PCB
Brown
Oxide		 De-oil 210 Removes oxide film, dust and finger prints from copper film surface Regular PCB
Pre-dip 240 Prevents infusion of other chemicals into oxide Regular PCB
Oxide 260 Acidic oxide agent with strong acid-endurance and provides oxide film of organic metal FPCB/Regular PCB
De-oil 270 Removes oxide film, dust and finger prints from copper film surface Regular PCB
Oxide 280 Turns interior layer copper film surface into dark copper oxide Regular PCB
Oxide 290 Enhances bonding between interior circuit layers and post-process black oxides Regular PCB
De-smear Sweller 310/315 Clean smudges and oil from surface; removes epoxy residue inside holes FPCB/Regular PCB
De-smear 340 Removes drill smear on epoxy surfaces with fiber residue
Neutralizer 370 Removes foreign matters from inside holes
PTH
 De-oil 410/410P Removes oil from glass fiber surfaces and epoxy surfaces to maximize catalyst or bonding function FPCB/Regular PCB/EMI
Pre-dip 430/435 Protects catalyst
Catalyst 440/445 Catalyst is bonded on surfaces
Activation 450/455 Bonded catalyst is augmented
Chemical Copper 460/460F/465 Copper plating of Through Holes on PCB
4650 Assign conductivity through EMI plating
Immersion
Tin		 De-oil 510 Removes finger prints and other pollutants from PCB surfaces FPCB/Regular PCB/EMI
Etching 520 Forms roughness on surface to enhance bonding
Tin Plating 560 Forms uniform level Tin plating layer of 0.8~1.2 on copper film surface
ENIG
 De-oil 610 Removes oxide film, dust and finger prints from PCB surface FPCB/Regular PCB
non-iron, steel, cast iron, etc.
Etching 620 Forms roughness on surface to enhance bonding
Activation 640 Bonds Palladium on copper areas to act as activator catalyst for extraction of nickel
Nickel Plating 660 Under layer plating for gold plating
Gold Plating 680 Substitution type strike, non-electrolytic plating with excellent corrosion-resistance and solderability of Nickel
Stripper
 Lead Removal 711/715 Sn/Pb removal agent of nitric acid base FPCB/ Regular PCB
Rack Removal 720 Removes Sn/Pb and Du extracted in plating tub and rack
Dry Film Removal 730/731/740 Dry Film removal agent
Acid Etching 760 Copper film etching for circuit formation in Panel Manufacturing Process
Alkali Etching 771 Copper film etching for circuit formation in Panel Manufacturing Process
Electrolytic
Plating		 Electric copper brightener 810/813 Additive for electric copper plating over non-electrolytic copper plating FPCB/ Regular PCB
Solder brightener 830 Additive to solder plating solution for pattern protection Regular PCB
Others PSR Removal Agent 960 Completely removes fully hardened dry film and photo-imageable solder mask Regular PCB
Oxidation prevention agent 970 Concentrated oxidization prevention agent that delays surface oxidation as much as possible on electrolytic copper plating, non-electrolytic copper plating, silver plating, solder plating and non-iron metals FPCB/ Regular PCB
Defoaming agent 980 Defoaming agent of non-silicon type added to development agent and peeling agent of dry film, PSR and LPR Ink FPCB/ Regular PCB
Equipment detergent 990 Washing liquid of spray type to wash spray devices
(development, etching and peeling)		 Regular PCB