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INTERIOR LAYER
DISK
FILM DEPOSITION
FILM DEVELOPMENT
COPPER ETCHING
FILM REMOVAL
SURFACE OXIDATION
MLB
DRILLING
DE-SMEAR
CHEMICAL
COPPER PLATING
PRIMARY ELECTRO-
LYTIC PLATING
FILM BONDING
FILM DEVELOPMENT
SECONDARY ELEC-TROLYTIC PLATING
LEAD/TIN PLATING
FILM REMOVAL
COPPER ETCHING
LEAD/TIN REMOVAL
INSULATION LAYER DEPOSITION
INSULATION LAYER DEVELOPMENT
FINAL SURFACE TREATMENT
OTHER SPECIAL CHEMICALS
INTERIOR LAYER DISK
 
* Cut substrate to standard dimensions.
* After cutting, trim rough areas mechanically.
 
This is a mechanical fabrication process where no ORCHEM chemical is relevant.